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IEC 60191-4 : 3.0

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IEC 60191-4 : 3.0

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 4: CODING SYSTEM AND CLASSIFICATION INTO FORMS OF PACKAGE OUTLINES FOR SEMICONDUCTOR DEVICE PACKAGES

International Electrotechnical Committee

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Table of Contents

FOREWORD
1 Scope
2 Coding system of package outlines for
  semiconductor devices
3 Classification into forms of package
  outlines for semiconductor devices
4 Coding system for semiconductor-device
  packages
5 Coding system of package-outline styles
Annex A (informative) - Examples of descriptive
        coding system application
Annex B (informative) - Derivation and application
        of the descriptive coding system - Common
        package names
Annex C (informative) - Terminology of semiconductor
        package outlines

Abstract

Defines a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47